| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| AM3352BZCZ100 | 单片机MCU |
TI/德州仪器 |
BGA |
24+ |
5966 |
|||
| AM3352BZCZ60 | 单片机MCU |
TI/德州仪器 |
BGA |
24+ |
5623 |
|||
| XC7S15-2CPGA196I | 单片机MCU |
XILINX/赛灵思 |
BGA |
24+ |
2659 |
|||
| MCIMX6U6AVM08AD | 存储IC |
NXP/恩智浦 |
BGA |
24+ |
3555 |
|||
| MCIMX287CVM4B | 单片机MCU |
NXP/恩智浦 |
BGA |
24+ |
3969 |
|||
| QCA8337N-AL3C | 其他被动元件 |
QUALCOMM/高通 |
QFN |
24+ |
2968 |
|||
| QCA9375X-AL3D | 其他被动元件 |
QUALCOMM/高通 |
QFN |
24+ |
1899 |
|||
| XC3S50-4VQG100C | 单片机MCU |
XILINX/赛灵思 |
QFP100 |
24+ |
2988 |
|||
| XC3SD3400A-4FGG676C | 单片机MCU |
XILINX/赛灵思 |
BGA |
24+ |
2988 |
|||
| TMS320DM642AZDK6 | 32位MCU |
TI/德州仪器 |
BGA |
23+ |
2899 |
|||
| TMS320VC5410PGE100 | 16位MCU |
TI/德州仪器 |
TQFP144 |
23+ |
2988 |
|||
| MC56F8023VLC | 16位MCU |
NXP/恩智浦 |
LQFP-32 |
23+ |
3456 |
|||
| MC56F8355VFGE | 16位MCU |
NXP/恩智浦 |
LQFP128 |
23+ |
3255 |
|||
| ST10F272-BAG | 其他被动元件 |
ST/意法 |
TQFP144 |
23+ |
2235 |
|||
| XC7A35T-2FTG256C | 单片机MCU |
XILINX/赛灵思 |
BGA |
23+ |
2836 |
|||
| SERCON816 | 其他IC |
ST/意法 |
QFP100 |
23+ |
2532 |
|||
| ADC12048CIVF | 转换器IC |
TI/德州仪器 |
QFP44 |
23+ |
3625 |
|||
| XC7K410T-2FFG900I | IC |
XILINX/赛灵思 |
BGA |
23+ |
165 |
|||
| XC7Z045-2FFG676I | 单片机MCU |
XILINX/赛灵思 |
BGA |
23+ |
165 |
|||
| XCVU3P-2FFVC1517E | 逻辑IC |
XILINX/赛灵思 |
BGA |
23+ |
55 |
|||
| LM3S9D96-IQC80-A2 | 其他被动元件 |
TI/德州仪器 |
QFP100 |
23+ |
658 |
|||
| AN82527 | 其他被动元件 |
INTEL/英特尔 |
PLCC44 |
23+ |
3499 |
|||
| XCV300E-6FG456I | 其他被动元件 |
XILINX/赛灵思 |
BGA |
23+ |
2459 |
|||
| XCV300E-6FG456C | 其他被动元件 |
XILINX/赛灵思 |
BGA |
23+ |
2578 |
|||
| TMS320C6713BZDP | 其他被动元件 |
TI/德州仪器 |
BGA |
23+ |
2356 |
|||
| LPC4330FBD144 | 存储IC |
NXP/恩智浦 |
QFP144 |
23+ |
3569 |
|||
| XC6SLX16-2CPG196I | 单片机MCU |
XILINX/赛灵思 |
BGA |
23+ |
3256 |
|||
| XC3S700A-4FGG400C | 其他被动元件 |
XILINX/赛灵思 |
BGA |
23+ |
3256 |
|||
| XC3S1200E-5FGG400C | 单片机MCU |
XILINX/赛灵思 |
BGA |
23+ |
3215 |
|||
| XC3S1200E-4FGG400I | 单片机MCU |
XILINX/赛灵思 |
BGA |
23+ |
2756 |